The research of parameters of multiprobes connecting device for electronic components testing

Authors

  • И.Ш. Невлюдов
  • И.В. Жарикова

Abstract

The problems associated with research into parameters of the multiprobes connecting device for BGA electronic components testing are considered. The results of measurements of the contact resistances and resistances of wires on the flexible connecting board are presented. The received results make it possible to define the needed clamping pressure of a polyamide flexible connecting board to the unit under test and also to be convinced of the uniformity of the testing device designed topology.

References

Невлюдов, И.Ш., Мартыняк, Р.М., Палагин, В.А., Слободян, Б.С., Разумов-Фризюк, Е.А., Жарикова, И.В., Дмитрив, М.И., Беляев, А.С. Подключающее МЭМС-устройство для контроля BGA-компонентов // Технология и конструирование в электронной аппаратуре. – 2012. – №1. – С. 54–56.

Пат. 95190 України. Мікроелектромеханічний багатозондовий підмикальний пристрій / Борщов В.Н., Жарікова І.В., Кощій Л.Д., Лістратенко О.М., Невлюдов І.Ш., Палагін В.А., Проценко М.А., Разумов-Фризюк Є.А., Старченко О.П., Тертишний С.М., Тимчук І.Т. 11.07.2011.

Lumbantobing, A., Kogut, L., Komvopoulos, K. Electrical Contact Resistance as a Diagnostic Tool for MEMS Contact Interfaces // Journal Of Microelectromechanical Systems. – 2004. – Vol. 13, Issue: 6. PР. 977–987.

Невлюдов, И.Ш., Борщев, В.Н., Палагин, В.А., Разумов-Фризюк, Е.А., Жарикова, И.В., Тымчук, И.Т., Лукачев, О.Б., Проценко, М.А. Топология гибкого шлейфа для подключения к автоматизированным измерительным комплексам микросхем корпусе FG-320 // Технология приборостроения. – 2012. – №1. – С.21–25.

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How to Cite

Невлюдов, И., & Жарикова, И. (2012). The research of parameters of multiprobes connecting device for electronic components testing. Radiotekhnika, 3(170), 137–140. Retrieved from http://rt.nure.ua/article/view/174972

Issue

No. 170 (2012): Radiotekhnika

Section

Articles

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